3d Technology, The Electronics Industry Needs For Three Major Reasons
Recently, the 3D advertising everywhere. The first 3D TV has been selling; TV shows are beginning to use 3D technology plays, most of them sporting event; while many films released eye-catching, 3D version. However, 3D technology has not only been used in consumer electronics and entertainment, 3D extraction technology (3Dextraction) was also applied in some areas of IC design. Designers try to improve the forecasting performance after the design and other acts of accuracy.
Why use 3D extraction technology? It all comes down to the design and production needs, from the design point of view, of a more precise circuit model simulation, to the designers, such as time, power consumption and noise performance characteristics, as well as other important parameters such as gain, bandwidth and reliability.
2.5D extraction what are the deficiencies?
Large EDA suppliers of traditional tools are polarized. On the one hand, 2.5D geometry layout extraction equipment here, equipment and interconnection to find and pre-characterized pattern matching. When its time to find a match, start checking size, run some calculations to generate R and C values for the back mark (back-annotation) the network table. In terms of these products, capacitors are usually few problems, its performance is usually acceptable (although the run time, it is because a series of more complex detection mode); more and more the problem is accuracy. For example, Figure 1 shows a typical MOMCAP structure, this is because the 3D topological structure needs to ensure the accuracy of the 3D acquisition, while the 2D or 2.5DExtractor can not accurately deal with this topology.
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In the more advanced process nodes, designers need to extract a combination of increasingly complex in a metal part of the interconnection between heap stack, as well as the interconnection between devices and crosstalk between the marginal and shielding capacitors, etc. Distributed RC model. And do not forget the substrate. 2.5D extraction because the lack of accuracy required for nanometer design, designers have to take a conservative or passive design techniques, using sub-optimal design. Otherwise, it is designed to fail.
On the other hand, the existing 3D extraction technology, to a large EDA company (field solver?? Using finite element, finite difference, boundary element or a similar method for the Maxwell equations provide accurate solutions) in the face in the face of today’s large and complex design, its low computational efficiency, in addition to careful use of other than focusing on anything in terms of its running time is unrealistic. Supporters of these tools often explained that the thickening of the grid, running time can be improved, and it does work. But with considerable loss of accuracy to obtain. In order to obtain the accuracy required of today’s design, there must be a fine texture, or dense grid, which will exponentially increase the run time and memory footprint. In addition, dense grid, had to compromise with the boundary conditions to reduce the memory footprint to control memory usage, the field solver to reduce the surrounding elements in the extraction of “interaction region”, ignored or not accurately describes the geometry around a little, and further affect the accuracy.
What is needed is a more accurate 3D extraction technology?
What is needed is a 3D acquisition technology, innovation, and to go beyond the limitations of existing solutions. The solution should provide without complex set of consistent and accurate network table, and can achieve sufficient to support a wide range of complex chips, scalable network and regional boundaries running time. In Silicon Valley the front (SiliconFrontline), we are introducing products 3D field solver, using new technology, so designers can use all the features of advanced process nodes, including new equipment types and DFM structure, while reducing the number of repeated calibration.
I am China Hardware Suppliers writer, reports some information about nikon d40x kit , fuji panorama camera.
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